Simulation of Thermal Barrier Layer Effects on Cu/PI Structures for Flexible Film Antenna Fabrication. Advances in Engineering Research : Possibilities and Challenges, [S. l.], v. 2, n. 3, p. 12–26, 2025. DOI: 10.63313/AERpc.9053. Disponível em: https://elibrary.erytis.com/index.php/AERpc/article/view/518. Acesso em: 18 nov. 2025.