Research on Apprenticeship Mode Adapted to Integrated Circuit Talent Training under the New Type of "School-Within-Factory"
DOI:
https://doi.org/10.63313/ESW.9109Keywords:
New Type of School-Within-Factory, Modern Apprenticeship, School-Enterprise Collaboration, Real-Post Intensive TrainingAbstract
Aiming at the shortage of high-skilled talents in the integrated circuit (IC) industry and the pain points in traditional apprenticeship models (scenario segmentation, content lag, and single certification), this paper proposes and practices a modern apprenticeship innovation mode adapted to full-cycle IC talent training. Relying on the advanced semiconductor "New Type of School-Within-Factory" at Suzhou Industrial Park Institute of Vocational Technology, the mode takes "School-Enterprise Collaboration for Foundation Building, Real-Post Intensive Training for Skill Strengthening, and Parallel Education-Training for Quality Improvement" as its core concept. Through reconstructing the "Physical-Management-Resource" trinity entity of the school-factory, innovating the "Three Integrations and One" (scenario, content, and certification integration) education mechanism, and designing an apprentice growth path combining "Eight-Step Intensive Training" with the "Competency Account" system, the mode effectively achieves seamless transition for students from "beginners" to "quasi-employees" and then to "high-skilled craftsmen." Practice shows that this mode has increased the employment rate of graduates in related fields by 26% and significantly raised their starting monthly salaries, providing high-quality talent support for the IC industry with significant promotion value.
References
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http://dx.doi.org/10.1080/028418501127346846
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[3] Liu, S., Wang, Y., & Zhang, Q. (2021). Digital twin technology in vocational training: A case study of semiconductor packaging and testing. IEEE Transactions on Education, 64(4), 472–480. https://doi.org/10.1109/TE.2021.3076135
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